Deepcool to Release Neptwin V2 CPU Cooler

Deepcool Industries Co. LTD has enriched its production line with a new CPU cooler, entitled Neptwin V2. Featuring 125x136x159 mm dimensions, the model allows for the installation of up to four fans, combined with a nickel-plated base, six copper heat pipes and a two-section voluminous heatsink which consists of 80 ribs (40 ribs for each section).

This cooler is known to support all up-to-date platforms, developed by Intel and AMD. As distinct from the majority of rivals, the Neptwin V2 framework is ready to accept four fans which operate by means of PWM technology. The base version comes with only two fans. The first one – Deepcool Wind Blade 120 – is equipped with a blue backlight; its rotational speed range varies from 900 to 1500 RPM. The second fan rotates at 1300 RPM. An overall noise level fluctuates within 21.4-32.1 dB boundaries.

It should be mentioned that total airflow volume produced by the fans might achieve 110.8-237.15 m/h. As a result, the cooler is …

Scythe Launches One More Chassis with Austere Design

Many customers know Scythe primarily for its delivery of high-end coolers. Nevertheless, the company is gradually extending its assortment by other PC components. Thus, it decided to launch a new brand PC chassis, codenamed Case by Case 3, that will be distributed initially on the internal market. The model is developed in mid-tower form-factor and features classical austere design. Steel casing is totally painted black (from the inside and outside).

Case by Case 3 is able to accommodate motherboards of ATX and micro-ATX standard. As it was mentioned before, the chassis is characterized by austerity in design and absence of any ornamental elements or distracting insertions in framework. The latter features some dedicated accessories for the screwless drive installation.

Internal layout is also estimated for the integration of power supply units of ATX format, four bays for 5.25-inch drives, seven slots for 3.5-inch hard drives or 2.5-inch SSDs. Additionally, the casing …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 13 November 2011, 11:44
Last visit: 13 November 2011, 11:44