New Budgetary Chassis K380 from Cooler Master

Cooler Master announces the release of a new entry-level chassis K380 (RC-K380-KWN1). This model will replenish the K Series of products and will feature mid-tower parameters (209x445x479 mm overall dimensions). K380 is basically intended at gamers, due to an eye-catching design: the chassis is housed in a solid casing made of steel and plastic with some aggressive inclusions and details. However, the major distinctive peculiarity ascribed to the newbie is its moderate price that will not exceed the border of $80. Affordability affirms Cooler Master's image of the company that skillfully combines high-quality with alluring prices.

The chassis is painted black from the inside and outside and accommodates a metallic grid on the frontal panel. Its side panel is notable by the availability of a large transparent window that showcases internal layout. In its turn, internal spacing is sufficient to locate motherboards of ATX and micro-ATX form-factor, graphics cards of 316 mm in …

Gigabyte to Start Selling X99M-Gaming 5 Motherboard

Gigabyte Technology is about to come out with a new micro-ATX gaming motherboard. The X99M-Gaming 5 features a promising black-and-red design, an enforced VRM system, and a sophisticated cooling solution. It is powered by Intel X99 chipset compatible with Intel Core i7/Haswell-E processors for socket LGA 2011-3. Heat dissipation process is entrusted to aluminum heatspreaders, joined by a nickel-plated copper heat-pipe.

The motherboard comes equipped with Ultra Durable hardware base, including solid-state capacitors with a prolonged lifespan. Moreover, it boasts advanced tools against short circuit on USB and Ethernet ports as well as against heightened humidity. Memory subsystem is introduced by four DIMM slots for DDR4-2133 modules (up to 32 GB capacity). Expansion facilities are backed by three PCI Express 3.0 x16 slots (the possibility to create 2-way CrossFire and 2-way SLI configurations), and a single PCI Express x1 slot.

To continue, in order to organize a data …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 26 November 2011, 12:54
Last visit: 26 November 2011, 19:01