Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Welcome in 703 and 707 PC Cases from In Win

In Win, a renowned Taiwanese hardware manufacturer, enters the market with two new PC chassis. The 703 model represents Middle-Tower segment, whereas the 707 model is a Full-Tower solution. Both products have combined only the best qualities much appreciated by modding fans and enthusiasts. They are housed in SECC steel cases and come in two versions: black and white coloring, with/without side acrylic window.



In Win 703 features 432 x 210 x 477 mm dimensions, being an ideal solution for middle-sized systems. Still, this case is ready to welcome full-format ATX motherboards, seven PCI Express expansion cards, 220 mm long PSUs, and 408 mm long graphics cards.


It is available in black and white case versions, both having a large acrylic window. The model offers external and hidden 5.25-inch drive bays, a pair of external 3.5-inch drive bays, and four internal 3.5/2.5-inch drive bays. All the drives boast screwless way of mounting.


The 703 has 170 mm depth; this feature …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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