D-Link Introduces New Storage Area Network Series DSN-6000

D-Link, a world-known manufacturer of network and telecommunications solutions, has officially introduced its two SAN models which are unified into a single series DSN-6000 iSCSI. The prime destination of this SAN series is to satisfy the needs of small and medium-sized business and to provide effective solutions of any emerging demands. DSN-6000 is characterized by the improved efficiency and performance index, as compared to the previous model lineups, on operation in virtual and physical environment.



The series is represented by two models: DSN-6410 iSCSI and DSN-6110 iSCSI. The both models go with the casing designed in 2U form factor, and is intended to be installed into a typical server frame. The models are equipped with twelve bays for drives and SAS interface. The cumulative volume capacity of the bays approximates to 36 Tb. DSN-6410 iSCSI is furnished with a couple of 10 Gigabit Ethernet ports, while the DSN-6110 iSCSI model accommodates four Gigabit Ethernet ports.

ID-Cooling Hunter Duet II Liquid Cooling System

ID-Cooling, being famous for its cooling systems, has released a Hunter Duet II cooler of large dimensions, which is supposed to transfer heat from the CPU and the graphics engine surfaces. This model is designed with a 360 mm heat sink, which is of great benefit to its efficiency factor.



The construction includes two water units with a base out of copper and built-in pumps, pipes in braided cable, the three-section aluminum 395 × 120 × 27 mm heat sink, three 120 mm fans, and an extraordinary framework with a 90 mm fan to blow over graphics card load-bearing elements and intensive plates for the CPU and GPU.


Though possessing similar construction, water units differ in lids design and the location of holes for liquid flow. At the moment their inner structure details are not available.

A compact fan to blow over VRM consumes 1.2 W. Its rotary speed is not higher than 1,500 rpm. The same ratio of each of the three main fans is not supposed to exceed 1,500–2,000 rpm.

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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Registered at: 04 March 2012, 13:01
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