Release of Low-Profile Cooler Slim Silence A-Plus from Gelid

Gelid Solutions, a Hong-Kong based renowned manufacturer of thermal solutions and other PC hardware, has lately presented its low-profile CPU cooler, codenamed Slim Silence A-Plus, for AMD platform. The new cooler is compatible with AMD AM2(+), AM3(+), as well as, FM1. According to the words of the Asian manufacturer, this model is capable to manage processors with the TDP index fluctuating in the measures of 95W.



There is one peculiar feature about Slim Silence A-Plus: its design resembles the design of coolers destined for GPU due to the foveate fan. That is why, customers can sometimes confuse this cooler's destination.


CPU cooler Slim Silence A-Plus goes in rather compact dimensions; its height does not exceed 28 mm, while its weight equals to 282 g. Such compactness provides for its unimpeded installation into chassis of different form-factor, starting from Mid-Tower, and finishing with Mini-ATX, 1U and HTPC.


The cooler's casing consists of an aluminum radiator …

Gigabyte to Start Selling X99M-Gaming 5 Motherboard

Gigabyte Technology is about to come out with a new micro-ATX gaming motherboard. The X99M-Gaming 5 features a promising black-and-red design, an enforced VRM system, and a sophisticated cooling solution. It is powered by Intel X99 chipset compatible with Intel Core i7/Haswell-E processors for socket LGA 2011-3. Heat dissipation process is entrusted to aluminum heatspreaders, joined by a nickel-plated copper heat-pipe.



The motherboard comes equipped with Ultra Durable hardware base, including solid-state capacitors with a prolonged lifespan. Moreover, it boasts advanced tools against short circuit on USB and Ethernet ports as well as against heightened humidity. Memory subsystem is introduced by four DIMM slots for DDR4-2133 modules (up to 32 GB capacity). Expansion facilities are backed by three PCI Express 3.0 x16 slots (the possibility to create 2-way CrossFire and 2-way SLI configurations), and a single PCI Express x1 slot.


To continue, in order to organize a data …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 23 May 2012, 21:35
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