Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Meet Three New Motherboards for Workstations and Servers from Gigabyte

Gigabyte, a global manufacturer of versatile PC hardware components, regularly updates its desktop motherboards product line, providing its customers with the most advanced facilities and performance. Still, the company is actively developing also a series of motherboards intended for the implementation into workstations and server systems.

Hence, Gigabyte has recently introduced three new models to replenish this series: GA-6PXSV4, GA-7PESH3, and GA-7PESH4. The users are able to create a really efficient system with the help of those boards in order to realize different computing activities due to GPU, CAD/CAE visualization or physical processors simulation.

All three motherboards are compatible with Intel Xeon E5-1600/2600 CPUs for Socket LGA2011 and take Intel C602 chipset as the basis. The first model from Gigabyte, GA-6PXSV4, features five expansion slots, including two PCIe 3.0 x16, one PCIe 3.0 x8, one PCIe 2.0 x1, and one more PCI. It supports up to 256GB of …

Company LEPA produces new power supplies B-series

LEPA introduced three new power supplies — B650-SA, B700-MAS and the B800-MAS, which will replace older models B750-MA, and B850-MA. Newcomers have been certified with 80 Plus Bronze (efficiency of 88% of the networks 230V), and met the standards of ATX12V v2.3 and EPS12V 2.92, and positioned as solutions for gamers and owners of GPU configurations SLI and CrossFire, workstations and small servers.

New items are equipped with inverter DC-DC (to improve stability), have the topology of Double Forward Circuit, as well as high-quality electrical components: solid capacitors and heat resistant (105 ° C) capacitors made in Japan.

Active cooling LEPA B700-MAS/B800-MAS is provided by 140-mm fan on double bearings. The model B650-SA has a fan size of 120 mm. The intensity depends on the rates of temperature sensor. Power Cables PCI-E, SATA and Molex flat are detachable. The main ATX 24-pin, as well as “CPU” EPS12V 8-pin are collected in a nylon sheath. LEPA B650-SA has …
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Registered at: 25 February 2012, 23:52
Last visit: 25 February 2012, 23:52