MSI works on development on three Mini-ITX motherboards based on chipsets A85, B75, and Z77

During August, MSI will release the two motherboards LGA1155 form-factor Mini-ITX, based on chipset Intel B75 and Z77. The first is positioned as a budget solution, the second is, in addition to support of overclocking Ivy Bridge K factor, will offer enhanced power system, and integrated Wi-Fi adapter and Bluetooth. Before the start of retail sales APU A-Series/Trinity (October) they will be joined by Mini-ITX motherboard based on chipset AMD A85.

From the pair of tiny “motherboards” B75/Z77 the greatest interest is for last one. The full codename of the model — MSI Z77IA-E53.

The upcoming model has seven power phases of processor socket with elements DrMOS and tantalum capacitors, power connector EPS12V 8-pin, two slots for RAM DDR3 (up to 16 GB of RAM) and a slot PCI Express 3.0 x16. Also, there are two SATA ports with a throughput of 3 and 6 Gb / s, single eSATA and mSATA (3 Gb / s). Jack mini-PCIe 5 GT / s is located directly above the mSATA — the original …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Enermax to Announce a New Mid-Tower Case Fulmo ST

Enermax Technology, an established Taiwanese developer of various PC hardware components, is about to announce its new roomy PC case within the boundaries of Fulmo series. Codenamed Fulmo ST, the case is designed in mid-tower form-factor and is distinguished by massy dimensions. Featuring 485x244x513 mm, the product’s weight approximates 8.2 kg. The novice will be available in two color variations: gray (ECA3270A-G-BL) and black (ECA3270A-B-BL).

Fulmo ST is ready to accommodate up to eight PCI expansion cards, three 5.25-inch drives and eight drives either of 3.5- or 2.5-inch standard. The case is compatible with ATX and micro-ATX motherboards, quite lengthy graphics cards (up to 412 mm if demounting the top HDD/SSD bay), as well as rather lengthy dual-heatsink for the water-cooling system (up to 280 mm). The latter might be replenished by ten fans of either 120 mm or 140 mm dimensional type.

Upon the whole, Enermax will deliver its Fulmo ST case with three …
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Registered at: 30 June 2011, 18:45
Last visit: 06 February 2013, 01:13