Lifting the Veil from USB Type-C Bus

Since the launch in 1995, Universal Serial Bus (USB) has proved itself as the most successful ever computing interface. Nowadays tens of billions of electronic devices are connected together due to it. It goes without saying that this bus has outlived a few modifications, each distinguished by higher speed and reliability. Thus, today the community is able to revel in a completely new modification – USB Type-C – that forecasts a lot privileges of connectivity process. Let’s see what users will get with a new bus.



Layout and Connectivity


In physical terms, Type-C is a bit larger than USB 2.0 Micro-B but a bit tinier than binary USB 3.0 Micro-B, featuring 8.34x2.56 mm. Such dimensions enable its connection to the devices of any type, including the thinnest smartphones/tablets. The oval-shaped socket houses 24 contact outputs (to compare: USB 3.0 sockets feature only 9 outputs).


The most outstanding physical peculiarity of Type-C is a symmetric connector that …

Gigabyte Debuts with Mini-ITX Motherboard C1007UN-D

Gigabyte has officially introduced a new motherboard model C1007UN-D, developed in mini-ITX form-factor. As seen from the dimensions, the novice is intended to be employed within small-sized multimedia or industrial systems. Chipset Intel NM70 with the integrated two-core ULV processor Intel Celeron 1007U are considered to be the heart of the board. The CPU is cooled down by a compact active cooling system which involves an aluminum heatsink and a small fan.



Video subsystem is represented by an integrated graphics core that belongs to Intel HD Graphics series. The core runs at the nominal 350 MHz clock frequency, however this index might be dynamically increased up to 1000 MHz. Audio subsystem is realized by means of Realtek ALC887 controller that supports 7.1-channel sounding. Network facilities (LAN) are ensured due to a pair of gigabit controllers elaborated by Realtek.


To continue, memory subsystem consists of two DIMM slots which support up to 8 GB modules of DDR3-1333 …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 20 November 2012, 18:35
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