Intel to Officially Unveil a Flagship Motherboard DZ87KLT-75K

Several days are left till the official introduction of a new flagship motherboard from Intel, known as DZ87KLT-75K (Kinsley). The board is based on an overclocking Z87 Express chipset and employs 8-phase CPU power supply system. Memory subsystem is represented by four DIMM slots for DDR3 modules, while expansion facilities involve three PCIe 3.0 x16 slots, three PCIe 2.0 x1 slots, a single PCI and a single mini-PCI slot. Storage capacities accommodate eight SATA III 6 Gb/sec ports.

Overclockers, as well as experienced users, will receive an opportunity of utilizing Power and Reset buttons right from the printed circuit board. This model offers 7.1-channel sounding, based on a corresponding controller, eight USB 3.0 ports, FireWire port, optical S/PDIF, a pair of gigabit Ethernet ports to enable network options, a single mini-DisplayPort and one Thunderbolt port. Frontal interface panel is able to propose a couple of USB 3.0 ports, Bluetooth 4.0 and Wi-Fi 802.11 b/g/n modules. … …

Thermalright Unveils a Colossal HR-22 CPU Heatsinks

Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.

Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.

All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
Get computer-assisted driver search with our brand utility *
* The Utility requires installation. Upon installation and running DevID Agent will detect
which devices require drivers and which drivers require updates.
The Utility doesn't contain viruses or malicious code
Registered at: 15 August 2011, 13:49
Last visit: 15 August 2011, 13:49