Greeting New ProLite X2783HSU Full-HD Monitor from Iiyama

Iiyama Corp., a leading Japanese designer of high-end PC monitors and TV-sets, has recently released a new representative of ProLite series – the X2783HSU Full-HD monitor (1920x1080 resolution). The new-comer features 622.5x400.5x230 mm dimensions and 27-inch display with an anti-glare coating. Its case boasts a stylish, black glossy finish that adds to the model’s elegant design.

The Iiyama ProLite X2783HSU is based on AMVA+ array that comes along with a rear LED backlit. The array demonstrates the following specifications: aspect ratio – 16:9, response timeframe – 4 ms (GtG), contrast – 3000:1/5M:1 static/dynamic, viewing angles – 89/89 degrees up/down and 178/178 degrees H/V, amount of displayed colors – 16.7 m, maximal brightness – 300 cd/m2, synchronization – separate.

The monitor is equipped with a pair of speakers of 4 W power, an analog D-Sub connector, digital HDMI and DVI-D (with HDCP support) connectors, I/O audio connectors, Kensington lock, …

Intel Debuts with Skull Canyon NUC Mini-PC

Skull Canyon was designed to dispel stereotypes about low efficiency of compact-sized PCs. Intel tried hard to take its mini-PC to the next level. Hence, the company furnished it with a 4-core Core i7-6770HQ CPU (Skylake) with support of Hyper-Threading. It features 6 MB L3 cache, 45 W TDP and runs at 2.6/3.5 GHz frequency. The CPU incorporates Intel Iris Pro Graphics 580 (GT4e) graphics core with 72 computing units and an additional eDRAM of 128 MB (frequency index: 350-950 MHz).

Intel Skull Canyon is housed in a stylish case with skull logo, featuring 216x116x23 mm dimensions & 0.7 liters capacity. The model accommodates a pair of So-DIMM DDR4-2133+ slots, allowing to install up to 32 GB of memory. Storage subsystem might be organized thanks to a pair of M.2 slots which support SSDs with SATA or PCI Express x4 interface.

This mini-PC comes with Intel Dual Band Wireless AC 8260 adapter that is thought to support Wi-Fi 802.11ac and Bluetooth 4.2 connectivity. The rear panel …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 04 April 2012, 20:24
Last visit: 04 April 2012, 20:42