MSI Offers H87I AC Motherboard for Demanding PC Builders

MSI has made a pleasing presentation for all builders and enthusiasts who would like to create a small-sized but highly efficient gaming or multimedia system. The MSI H87I AC is designed in mini-ITX form-factor, featuring 170x170 mm dimensions only. The core of the board is Intel H87 Express chipset that supports all Haswell CPUs with LGA1150 socket. According to the latest data, the model is already available in the European market for approximately 102 EUR.



The H87I AC accommodates two DIMM slots, available for the incorporation of DDR3 modules with the maximal frequency of 1600 MHz. The latter might work in a two-channel mode and reach 16 GB capacity. Disk subsystem is organized by means of four SATA III 6 Gb/sec ports, which allow for the creation of diverse RAID configurations (i.e. 0, 1, 5, 10, AHCI).


Expansion is realized due to a single PCI-e 3.0 x16 connector and one mini-PCI-e (half-size) connector for network modules. Network abilities are supported by one …

MSI Introduces Newest Z77A-GD65 Gaming Motherboard

First displayed at CeBIT 2013, MSI Z77A-GD65 Gaming motherboard is now showing out in the company’s product line. As suggested by the name and attention-getting design, the board has been elaborated specifically for gaming needs. The new-comer is based on Z77 chipset, features ATX form-factor, and supports Intel LGA1155-compatible processors of the second and third generation (Sandy Bridge/Ivy Bridge).



Among the most attractive facilities ascribed to the model, it’s possible to distinguish the incorporation of Qualcomm Atheros Killer E2200 network platform. This platform provides for a substantial improvement of network connection quality, by means of defining all gaming traffic and assigning it a major priority.


The motherboard is known to employ high-quality Military Class III components, including CopperMOS elements in copper cases, gold-plate throttles with Golden SSC ferrite mandrel, tantalum Hi-c CAP capacitors, as well as solid-state capacitors with …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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