Enermax Starts Selling Chassis Hoplite ST

Enermax Technology Corp. has voiced good news about the appearance of its new chassis Hoplite ST in the European market. The basic destination of Hoplite ST model is the creation of gaming PCs of the entry and middle level. The chassis is developed in midi-tower form factor and is compatible with motherboards of micro-ATX and ATX standards. Hoplite ST is delivered in two colors: models with black casings were codenamed ECA3261-B, while models with white casings – ECA3261-W.



The casing is made of SECC steel and has got rather convenient framework. The chassis contains four external 5.25 inch bays and six internal ones destined as for 3.5 inch drives, so for 2.5 inch drives. It is also equipped with seven expansion slots, and ready to accommodate graphics cards of up to 403 mm in length, as well as, CPU coolers of 167 mm in height.


The nominal delivery kit of Hoplite ST chassis involves two 120 mm fans. The frontal fan goes with LED lighting; the other fan is located at …

D-Link Starts Shipping High-Speed Cloud Router 5700

D-Link has expanded its lineup of network solutions with a new router model Cloud Router 5700. This router is known to provide an unmatched speed of data transferring due to the improvement of network technologies. The model is able to support Wi-Fi 802.11ac standards and can reach 1.75 Gb/sec. According to the nominal specifications, this type of wireless connection achives the maximal speed of 1.3 Gb/sec on data trasfer. However, manufacturers claim that their new product is going to surpass the previously voiced data.



Cloud Router 5700 has been designed to operate in two modes: Wi-Fi 802.11ac and Wi-Fi 802.11n. This ensures the additional speed of 450 Mb/sec. One of the peculiarities realized in this model is the availability of Cloud App application. This application allows for remote monitoring and control over the local network. Thus, each customer receives extra facilities for the efficient employment of the device. D-Link product supports IPv6 standards and such security …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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