Thermalright Shows up a Hard-Hitting Archon IB-E X2 Cooler

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.



Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.


The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.


Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Asus to Start Shipping Radeon R9 290 DirectCU II OC Graphics Card

Next week Asus is going to start shipping its newest graphics card from Radeon R9 series. Codenamed Radeon R9 290 DirectCU II OC, it is based on an original PCB with black-and-red design and the incorporation of an exclusive DirectCU II cooling system. Plus, the availability of ‘OC’ in the codename implies the availability of factory overclocking.



Asus Radeon R9 290 DirectCU II OC takes GCN Hawaii core with 2816 stream processors as the basis. It operates at an overclocked 1000 MHz frequency. The model is equipped with 4 GB of GDDR5 memory (512-bit bus) that runs at an effective 5400 MHz frequency. Just for a comparison, etalon adapter from AMD runs at 947 MHz/ 5000 MHz for GPU/memory correspondingly.


DirectCU II cooler consists of a heatsink, four copper nickel-plated heatpipes (two of them feature 10 mm dimensions), and two high-performance fans: one ordinary and one CoolTech. The card receives power via 6+8-pin connectors and might require not less than 600 W PSU.
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Registered at: 03 July 2011, 21:28
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