Thermaltake Showcases an Original Bigwater 760 Pro Cooling System

Thermaltake Technology, a renowned Taiwanese designer of varied PC hardware pieces, is going to release its new original water-cooling system, codenamed Bigwater 760 Pro. This cooler is targeting powerful processors that require no less powerful cooling. The product demonstrates a wide compatibility with all novel processors that support Socket LGA775, LGA1366, LGA115x, LGA2011, FM1, FM2, AM2(+), and AM3(+).

Bigwater 760 Pro consists of three major parts: waterblock, head block and a couple of hoses. The implemented waterblock features nickeled-copper base of 45x35 mm dimensions. The head block features 252.8x145.8x84 mm dimensions and takes two 5.25-inch bays within the chassis. Its framework involves a pump, a heatsink and a tank for coolant.

The pump is based on a ceramic bearing and produces not more than 16 dB noise. Its performance level achieves 500 liters/hour, while Mean Time Between Failures index is estimated at eighty thousand hours. The integrated heatsink is …

Asetek to Finalize the Development of the 4Gen LCS

Asetek, a well-known manufacturer and supplier of water/liquid cooling solutions, announces the final stage in the development of the 4th generation of its patented liquid-cooling system. Currently, the products developed by Asetek are widely used by OEM-companies in their own systems. However, in accordance with the voiced information, the LCS of the fourth generation will be delivered as OEM-product line, so as a brand Asetek product. The prospective release date is scheduled for the end of 2012.

The 4th generation of patented liquid cooling systems features an elaborated waterblock base and totally refined pump. Such improvement might provide for a dramatic increase in performance. The implemented pump creates a higher pressure and more efficiently distributes the liquid current at the entrance to the micro-channel base structure.

At the same time, thermal resistance has been reduced at 20% which resulted in 1.2 times better waterblock heat irradiation properties. …

AMD Announces the Development of Steamroller

Heightened demand for high-end processor solutions and ever rising competition make AMD constantly develop its products. This usually results in the release of really outstanding items, such as already acknowledged Bulldozer and Piledriver. Therefore, according to the words of the companies technical manager, Mark Papermaster, the development of a new processor architecture, codenamed Steamroller, is already on order of AMD's business. The ready-made products are sure to be released next year. Steamroller is called to become the third edition of Bulldozer architecture that launched last year and a loyal companion of Piledriver core.

The initial data witness that processors on Steamroller architecture will be designed in correspondence with 28 nm technological process. This should favorably affect their efficiency and enlarge the performance by 15-20% at equivalent power consumption and clock frequency. At the same time, Steamroller will improve all specifications implemented in …
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Registered at: 08 July 2012, 18:41
Last visit: 04 February 2013, 18:23