Evga Debuts with a First-Rate ACX CPU Cooler

Evga, a company primarily known for high-end graphics solutions, decided to expand its production line by entering cooling market. Herein, it elaborated a first-rate CPU cooler, entitled ACX (codename: 100-FS-C201-KR). The new-comer features 164x134.5x91.5 mm dimensions and weighs 1065 g. Luckily, it can be already found in free sale for a price of $50.

The ACX is a tower-like air cooler that is able to efficiently remove heat from all processors that are compatible with the following sockets: Intel LGA 2011/1156/1155/1366/1150/775 and AMD FM1/FM2/AM3/AM3+/AM2/AM2+.

Evga ACX consists of an aluminum heatsink, five copper heatpipes that support Direct Touch technology, and one PWM fan of 120 mm dimensional type. The heatsink is composed of multiple thin plates, which differentiate themselves by an unusual framework. Such framework enables the emergence of two airflows around the heatpipes. According to Evga, this promotes for a better heat removal process.

The …

SilverStone Replenishes Its Nitrogon Series with Two Coolers

SilverStone, a Taiwanese manufacturer of high-end cooling solutions, has recently launched two new coolers codenamed NT01-PRO and NT06-PRO. Both models replenish the Nitrogon series and distinguish themselves by utmost compatibility. Hence, this couple is able to cool down practically all CPU systems developed by AMD and Intel, due to the support of sockets AM2, AM3, FM1, FM2 (AMD) and LGA775, 1155, 1156, 1366, and 2011 (Intel).

Coolers NT01-PRO and NT06-PRO consist of a copper-nickeled base, six heat pipes (6 mm each) and single-section aluminum heatsink. The first model NT01-PRO is delivered without nominal fans and features 140x97x120 mm dimensions. The customer gets the right to decide which fans, 70 mm or 80 mm, will provide more cooling effect to CPU. This cooler will benefit the most if integrated on the rear or top panel of PC chassis.

The second model NT06-PRO features 140x82x139 mm and is delivered with a single 120 mm fan. Its rotational speed is monitored by …

Micron to Carry Out the Production of TLC Memory Next Year

Memory market, similar to other industries, undergoes certain changes and updates from time to time. Therefore, memory manufacturers are currently trying to comply their production with two major tendencies: considerable drop in demand for RAM, employed basically in desktop PCs, and simultaneous growth of demand for solid-state drives, employed in compact tablets and mobile devices. Besides, the latter is developed at lightning speed.

Micron, one of the leading memory manufacturers, feels like no one else all the changes and fluctuations in the market. Its quarterly reports witness about the relentless drop in demand for DRAM (9% drop at average) for the report period. At the same time, increase in SSD segment is estimated at 5% at average. Sales volume of NOR memory type did not outlive serious changes.

According to the preliminary data, Micron is going to carry out the production of memory on TLC microchips, manufactured under 20 nm technological process. The assumed …
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Registered at: 03 April 2012, 15:07
Last visit: 04 April 2012, 00:12