ID-Cooling Hunter Duet II Liquid Cooling System

ID-Cooling, being famous for its cooling systems, has released a Hunter Duet II cooler of large dimensions, which is supposed to transfer heat from the CPU and the graphics engine surfaces. This model is designed with a 360 mm heat sink, which is of great benefit to its efficiency factor.



The construction includes two water units with a base out of copper and built-in pumps, pipes in braided cable, the three-section aluminum 395 × 120 × 27 mm heat sink, three 120 mm fans, and an extraordinary framework with a 90 mm fan to blow over graphics card load-bearing elements and intensive plates for the CPU and GPU.


Though possessing similar construction, water units differ in lids design and the location of holes for liquid flow. At the moment their inner structure details are not available.

A compact fan to blow over VRM consumes 1.2 W. Its rotary speed is not higher than 1,500 rpm. The same ratio of each of the three main fans is not supposed to exceed 1,500–2,000 rpm.

New Motherboard from Gigabyte with Ultra Durable 4 Classic Design

Gigabyte has recently introduced a new motherboard intended specifically for the creation of budgetary entry-level systems. Codenamed Gigabyte GA-H61M-USB3H, the model is developed in micro-ATX form-factor and features 226x174 mm dimensions. Chipset Intel H61 Express secures all key functions of the board, while the support of Socket LGA1155 empowers the incorporation of CPUs based on Intel Ivy Bridge and Intel Sandy Bridge architecture.



GA-H61M-USB3H features only two 240-contact DIMM slots for the installation of up to 16 GB of DDR3-1333 MHz memory. Video subsystem might have dual nature: it might either employ an integrated into CPU graphics core or use an independent graphics card with PCI Express 3.0 x16 internal interface. Audio subsystem is represented by Realtek ALC887 controller which secures 7.1-channel sounding. Network facilities are ensured by 1x gigabit network controller powered by Realtek.


The connection of external displays is realized via three video …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 13 March 2011, 17:01
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