PSU Thermaltake Toughpower Grand 700W Review

Toughpower Grand series is one of the foreground PSU lines in the production gamma of Thermaltake. The series is replenishing with ever newer models from time to time, offering more advanced facilities and more efficient power. Model Toughpower Grand TPG-700M is one of the latest power supply units from this manufacturer. Its is characterized by the availability of 80Plus Platinum certificate and the employment of high-quality capacitors that ensure its stability of operation. Upon the whole, TPG-700M might be called a worthy follower of Toughpower series.

Specifications and User Experience

Thermaltake Toughpower Grand 700W is notable by a quite wide temperature condition range which fluctuates within the measures of 0 up to 50 degrees. The power on +12VDC rail is estimated at 696W (58A). The correlation of power on this rail with the total power makes up 0.994; this is a sample index for such type of units. All other basic specifications of the model are indicated on the …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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Registered at: 01 April 2012, 03:35
Last visit: 01 April 2012, 03:35