The Introduction of Transparent Chassis from Scythe

Scythe has recently amazed the community by the introduction of absolutely transparent chassis. ACB-Type3 model preserves the cutout of the standard Mid-Tower chassis solutions, but is made of transparent acrylic plates. One more peculiarity of this model is the parallel to the base localization of motherboard. Besides, ACB-Type3 is compatible with motherboards of various form-factor, including mini-ITX, micro-ATX, and ATX.

The motherboard is accommodated on a special tray. Right under this tray the customers are able to find a set of bays designated for the installation of PSU, three 3.5-inch drives, a couple of 2.5-inch drives, and three 5.25-inch drives. The chassis is compatible with CPU coolers of up to 190 mm in height.

At the same time, this model goes without any fans or side panels; this attributes the model to Open-Air segment. The product can content itself with practically noiseless passive system.

Scythe ACB-Type3 is equipped with sufficient number of …

Seagate Debuts with a New Line of NAS Systems

It is a well-known verity that corporate field sets up its own requirements towards PC hardware and server systems. Seagate totally realizes this fact, designing dedicated products to ensure all foremost facilities for business boost. With this purpose, the company has launched a new line of NAS servers, codenamed Seagate Business Storage.

The line is represented by models that are equipped with one, two or four drive bays, the overall volume capacity of which might vary from 2TB to 16TB. One-bay NAS model features 172x60x147 mm dimensions, two-bay model features 310x155x275 mm dimensions, and four-bay storage has got 240x247x377 mm dimensions.

All models included in the series are predestined to operate either on Windows or Mac OS X platforms. Thanks to the outstanding Seagate Business Storage facilities, corporate clients get an opportunity to fulfill data backup activity without any problems. In addition, these products might become a reliable basis for the …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 18 November 2011, 17:26
Last visit: 24 September 2014, 11:19