Zalman Boasts a New Line of PSUs with an Improved Design

The line of products manufactured by Zalman has been just replenished with a new series of power supply units, codenamed Zalman LX. The series is currently represented by two models of 500 W and 600 W power: ZM500-LX and ZM600-LX. Both units employ an improved Dual Forward Converter Circuit design that ensures reliable and efficient functioning. They are also equipped with a single +12V rail and show compatibility with Intel ATX12V 2.31 standard.



Zalman LX PSUs utilize a couple of PCI Express sockets (one 6-contact and one 6+2-contact) for the connection with graphics cards, securing the support of AMD CrossFireX and Nvidia SLI technologies. Cooling of all internal components is ascribed to a low-noise fan of 120 mm dimensional type. Its operation is automatically monitored by Smart Fan Control system that provides for the achievement of an optimal balance between its efficiency and noise level.


The new-comers support a large amount of protective options that promote for …

Biostar Announces N3150NH Mainboard with Integrated CPU

The inventory of Biostar’s mini-ITX motherboards was replenished by a new uncommon model – the N3150NH. Its key peculiarity is the availability of a 4-core Intel Celeron N3150 CPU onboard. The processor (Intel Braswell family, 14 nm technological process) comes equipped with an integrated Intel HD graphics core and a passive cooler. Its nominal clock frequency makes up 1.6 GHz, while on overclocking it accelerates up to 2.08 GHz frequency.



Biostar N3150NH houses two SO-DIMM slots, estimated for 8 GB DDR3-1600 MHz memory modules (two-channel operational mode). The connection of drives is realized via a pair of SATA III 6 Gb/sec ports. There is a possibility to install one expansion card thanks to a single PCI Express 2.0 x1 slot. Network facilities are ensured due to Realtek RTL8111H controller that supports SmartSpeedLAN utility, whereas audio production becomes possible due to the integration of Realtek ALC662 controller.


The connection of peripherals is enabled via …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 13 April 2011, 21:40
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