Presently the Passive CPU Cooling System by Hdplex is Retailed as a Standalone Product

The sale of Hdplex H5 case, meant for a passive cooling system assembling, started in fall. Inner components are constructed to be passively chilled down and work noiselessly. In fact, the Hdplex H5 framework constitutes a big heatsink dissipating heat outwards. With the help of the copper base heat from the processing unit is carried over heat pipes to the left side panel of the case.



The news is that lately this CPU passive cooling system has gone on sale as a standalone product, the supply set of which offers a copper base, an aluminium heat dissipator, eight 6 mm copper heat pipes, a portion of thermal grease and fittings for mounting on LGA115x Intel CPUs.


The system from Hdplex costs $65.

SSDs Corsair Neutron and Corsair Neutron GTX Review

Current conjuncture in the market of drives proves that SSDs do not require special advertising. Their demand index rises every single day, along with the increasing supply. Corsair, a well-known manufacturer of various PC hardware solutions, has successfully 'assimilated' advanced LAMD LM87800 controllers, and developed two SSD items at once based on this controller. Codenamed Corsair Neutron and Corsair Neutron GTX, these drives are intended at different customer audiences. Both models feature similar internal layout, but differ in the integrated interfaces and memory types.



Specifications


Model Corsair Neutron is considered to be cheaper than GTX version, so its specifications are more modest. It employs MLC flash-memory type with ONFI interface developed under 25 nm technological process. Its companion, Corsair Neutron GTX, belongs to the high-end SSD echelon and employs MLC flash-memory type with Toggle Mode interface designed under 24 nm technological process. Both …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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