SilverStone Debuts with SX700-LPT Power Supply Unit

SilverStone is readying to launch a powerful 700-watt PSU, entitled SX700-LPT. The new-comer boasts 80Plus Platinum certificate, since its efficiency level might reach 94%. The model is developed in SFX-L form-factor and supports Intel ATX 12V 2.4 standard. SilverStone has already listed the unit on its official site; thus, customers might expect the market launch in the nearest future.

SilverStone SX700-LPT employs a single +12V rail with the maximal output capability of 58.4 A. This power supply unit is able to operate within 90-264 V range at the peak power index of 750 W. If there is a need, it’s possible to use the entire power stock via +12V bus, rather than distributing it via +3.3 V or +5 V rails.

The model comes with a modular cable system. The inventory includes connectors for the connection of 9 SATA devices as well as 4 videocards with an additional 6+2-pin PCI-e connector. The unit is fitted with all necessary protection mechanisms, entailing SCP, OPP, OPT, …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.

The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.

The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.

Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 19 May 2012, 10:07
Last visit: 19 May 2012, 10:07