FSP Intros ‘Noiseless’ PSU Model Aurum Xilenser 500

FSP, a renowned developer and supplier of power supply units, introduces a new product that is widely recognized as ‘noiseless’ PSU. Codenamed FSP Aurum Xilenser 500 (AU-500FLD), it employs a passive cooling system instead of an air cooler, thus its dump operation is easily explainable. The unit also characterizes by a startling efficiency which provided for the acceptance of 80+ Gold certificate.

Aurum Xilenser 500 takes similar to Aurum Pro/CM models design with a totally black casing and a comb-like top grid enclosed in a golden stripe. The model is able to operate at the nominal 500W power and support the latest ATX12V/EPS12V standards. It should be noted that this unit utilizes a standard framework with all power connectors soldered on the printed circuit board. A set of connectors involves five SATA connectors, a single 4-contact FDD, four 4-contact Molex, and a pair of 6+2-contact PCI Express connectors. Naturally, it contains two main 24-contact and 4+4-contact …

PowerColor Outs an Overclocked Radeon R9 270 OC Graphics Card

Along with other AMD partners, PowerColor has elaborated its own version of Radeon R9 270 adapter. The PowerColor Radeon R9 270 OC is differentiated from rival products by an improved cooling system and factory overclocked frequencies. Its release is scheduled for late November and the retail price won’t hit over $180.

To begin with, this graphics card is naturally based on AMD Curacao Pro GPU, developed under 28 nm technological process. It consists of 1280 current processors, 32 ROPs and 64 TMUs. The core runs at 930 MHz frequency and is able to gain 955 MHz frequency on overclocking. The incorporation of GDDR5 memory (2 GB) with 256-bit bus interface ensures some striking bandwidth of 180 Gb/sec; this provides for the support of gaming applications with high resolution. Memory chip operates at 1400 MHz nominal frequency but might gain the index of 5600 MHz of effective frequency on overclocking.

Cooling system, implemented within Radeon R9 270 OC, cannot be called …

Cooler Master Starts a Batch Production of Two Seidon Models

Cooler Master announces an official release and starts a batch production of two new liquid cooling systems that join Seidon series. Codenamed Seidon 120XL and Seidon 240M, these two models will become a real smile of fortune for the devotees of up-dated technologies. Compact size and affordable price are the key advantages of Seidon representatives. Both liquid coolers demonstrate compatibility with such platforms, as Intel LGA 775, 1155, 1156, 1366, 2011, and AMD FM1, FM2, AM2, AM2+, AM3, AM3+.

According to Cooler Master, Seidon 120XL and Seidon 240M are quite independent systems which require minimal efforts while mounting or maintenance. They are a perfect choice for those people willing to provide enough room around CPU socket and simultaneously get the utmost cooling effect.

The first model, Seidon 120XL, is a refined version of Seidon 120M. It consists of a quite thick aluminum heatsink, copper micro channels, and a single 120 mm fan. In its turn, Seidon 240M …
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Registered at: 20 June 2012, 20:47
Last visit: 20 June 2012, 21:21