Overview of the MSI B250M Mortar Motherboard

January of 2017 was marked by the emergence of new processors Intel Kaby Lake-S, while the motherboard manufacturers have released products based on fresh 200- series chipsets. The PCH execution identity allows vendors to produce different models based on the earlier designed PCB. MSI B250M Mortar is one of the kind, as the manufacturer has a similar model – MSI Z270M Mortar.


Technical Characteristics



In fact, B250 is the youngest of the latest generation products. The most significant of its innovations is supporting the work of drives with PCI-E interface, mainly implemented in the popular now format M.2. The model is equipped with an expansion slot of this type. Additional adapters are unavailable, so all the possibilities come through Intel B250. The network interface uses the Intel controller, and the sound is formed by Realtek ALC892.


The B250M’s characteristics are as follows:


• Chipset – Intel B250 • Processor socket – Socket 1151 • …

Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.



Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.


Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …

Xigmatek Intros New CPU Cooler Gaia II

Xigmatek, an outstanding manufacturer of cutting-edge PC components, announces the release of a new CPU cooler, entitled Gaia II. The model is developed in accordance with a traditional tower-like framework and might be truly called a universal cooling solution. It supports a large variety of platforms for processors with TDP level of not higher than 150 W: Intel Socket LGA 775/1366/1156 and AMD Socket AM2(+)/AM3(+)/FM2/FM1.



Cooler Gaia II is designed with the direct implementation of H.D.T. technology (Heat Pipe Direct Touch). This implies that all three copper heatpipes, which stem from the heatsink base, come into direct contact with the CPU surface. The heatpipes themselves have got U-shape structure and 8 mm dimensions. They pierce ‘multi-plate’ aluminum heatsink to provide for a better heat dissipation.


The model is delivered with a pre-installed 120 mm fan with bright orange blades; it is fixed to one of the heatsink sides and housed in a black frame. The fan is …
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