Spire Showcases New Cylinder-Shaped Swirl IV CPU Cooler

Spire is going to release a new extraordinary cooling solution: a cylinder-shaped CPU cooler, entitled Swirl IV. It is targeting Intel processors for Socket 2011/1366/115x/775 and AMD FM1/FM2/AM2/AM3 platforms with the maximum TDP level of 130 W. The new-comer has received RoHS and CE certification that proves its environmentally-friendly nature. An official release is postponed to January 2015.



Spire Swirl IV features 131x125x62 mm dimensions and weighs 690 g. Its heatsink consists of 45 aluminum fins, pierced by three copper zinc-plated U-shaped heatpipes (8 mm). Inside the heatsink one can find a 60 mm fan with blue LED backlit. Its rotational speed is controlled by PWM technology so that the blades could run between 600 RPM up to 2000 RPM.


The fan is equipped with a slide bearing, estimated for 50.000 hours of fool-proof operation. It is powered by means of a 4-pin connector, ensuring up to 83.12 CFM airflow at 26 dB noise. Besides, at the highest rotational speed the …

Midi-Tower Chassis Corsair Obsidian 350D Review

Hardware components, supplied by Corsair, have always been treated as premium-class products. Whether it is an efficient power supply unit or high-performance RAM memory kits — all Corsair elaborations are distinguished by high quality and style. PC chassis are not an exclusion. Much talked-about Obsidian series is now supplemented with one more model – Obsidian 350D. This midi-tower case, intended for the installation of microATX/miniITX motherboards, differentiates from its colleagues by relatively compact dimensions, laconic and stylish design, as well as by an outstanding layout.



Design and Ergonomics


PC chassis Corsair Obsidian 350D is available in two design variations: with a transparent acrylic window on one of the side panels and with an entirely blind side panel. Acrylic window is fixed without any screws or claps; in order to remove it, it’s necessary to unscrew a couple of thumbscrews on the rear facet and move the window back. Like other Obsidian …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 18 December 2011, 19:31
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