Zalman Intros CNPS8X Optima CPU Cooler

Zalman is considered to be a key player in PC hardware field mainly due to a perfect combination of quality, functionality and price tags. CPU coolers are not an exception, since they ensure efficient and low-noise cooling of hard-hitting processors. The company’s latest CNPS8X Optima cooler is all about innovation that turns it around. Improved framework makes the model compatible with practically all platforms from Intel and AMD, save for Intel Socket LGA 2011/2011-v3/1366.

Zalman CNPS8x Optima employs a large heatsink, three copper heatpipes, and a single 92 mm fan. The latter is based on long-life bearing and features 4-contact connector. It is able to rotate at about 1200 RPM, producing not more than 30 dB noise.

The list of innovative technologies integrated into the cooler includes:

— Direct Touch Heatpipe (DTH) technology wherein all three heatpipes are in direct touch with a heatspreader. This accelerates heat dissipation process, enhancing overall …

Thermaltake Chaser A71 LCS Chassis with BigWater 850 GT on Board

Thermaltake Technology, a renowned Taiwanese manufacturer of PC hardware components, is going to release a new full-tower chassis of Chaser A41 series. Codenamed Chaser A71 LCS, the model distinguishes itself by a black stylish case with blue stripes on the frontal panel, a large transparent window on the side panel, and a gaming-type LED backlight. The overall dimensions of the new-comer are estimated as 537x205x565 mm, while the total weight reaches up 10 kg.

Thermaltake Chaser A71 LCS boasts some incredible capacity facilities. Thus, it is able to accommodate motherboards of E-ATX standard, three external drives of 5.25-inch form-factor, one external drive of 3.5-inch standard, as well as eight internal PCI cards and five bays for 3.5/2.5-inch drives. The chassis is ready to house rather voluminous graphics adapters, the maximal length of which equals to 244 mm, and rather high CPU coolers that reach up 160 mm.

The top facet of the case contains I/O panel that boasts …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 08 April 2012, 06:57
Last visit: 14 April 2012, 10:03