Lian Li to Combine Performance with Compact Size

Chassis of Full-Tower form-factor usually have solid framework due to the layout scheme and the necessity to enclose a lot of components. Developers from Lian Li company have totally demolished the current tendencies and announced the release of their PC-V750 Full-Tower model with the front-end PSU localization. This allowed the designers to dramatically decrement the size of the chassis without sacrificing its capacity and general specifications. The compact size of the chassis is considered to be a kind of ‘revolution’ in the market, since it is compatible not only with ATX and microATX motherboards, but also with Extended-ATX boards.

Lian Li PC-V750 casing is made of aluminum and approximates 7.35 kg in weight. Its dimensions provide for the installation of massive CPU-coolers (up to 170 mm in height), up to ten expansion cards, including 380 mm 3D cards. The chassis is equipped with five fans of 120 mm each: the two fans are located on the front plate, the other two – …

Stylish CPU Cooler Ice Hammer IH-4800 Review

Cooling solutions under Ice Hammer brand enter the market not so frequently as wished it to be. Still, the company manages to gladden all potential customers with high-quality products. This time, in close cooperation with Thermalright, it launched IH-4800 CPU cooler that is a modified version of True Spirit 140 model. Yet, what kind of options are going to attract the audience? Let’s find it out.

Heatsink and Fan Framework

The employed by the IH-4800 heatsink features 155x55x170 mm dimensions. It is a typical single-section tower, accompanied by six U-shape heatpipes. The pipes did not get nickel-plated coating, so they have a highly polished copper design. The heatsink embraces fifty aluminum ribs with 2 mm distance from each other.

The ribs are connected with the pipes by means of a dedicated neck finish with a thorough soldering. Six lower ribs do not have contact with two heatpipes, since the latter got a strongly pronounced curve at the output. The heatsink …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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