Top-Tier Chassis Zalman H1 Review

Zalman has long been deprived of a full-tower flagship PC chassis, after it discontinued the line of GS1200. The anticipation of a new etalon was accompanied by an overall market uncertainty as for the future of desktop platforms. Luckily, laptops and tablets couldn’t fully satisfy the customers’ growing needs, so Zalman decided to fire off with a new top-tier case, entitled H1. Stylish and magnetic from outside, this model has a lot of interesting options in the bins. Let’s have a look at them.



Key Features


Zalman H1 is a full-tower case, featuring 561x238x570 mm dimensions. The chassis is made of steel, aluminum and a high-quality plastic, with exterior and interior totally painted black. Internal layout allows for the installation of motherboards with elongated PCBs, including E-ATX and XL-ATX models. The model houses three external bays for 5.25-inch drives, seven internal bays for 2.5-/3.5-inch drives as well as nine expansion slots.


The case boasts some …

HP Employs Processors AMD Athlon II X2 221 and Sempron X2 198

The release of hybrid AMD processors of A series was announced about a year ago, however, their actual appearance in the market was delayed for a few months. It is a well-known fact that a part of those processors for Socket FM1 platform has got idle graphics block; this part of processors has been codenamed Athlon and Sempron. The two processor models from this series Athlon II X2 221 and Sempron X2 198 can be currently found in PCs manufactured by HP company.



Both processors have been observed in the list of specifications of desktop PCs delivered by HP: Athlon II X2 221 is employed in HP Pavillon p6-1169cx and p6-1226cn models, while Sempron X2 198 is employed in HP Pavillion p6-1152cx, 1230cx, 1231cx, and 1159cx models. The major peculiarity of such technological solution is that HP PCs with those processors are delivered only to the Chinese market.


Two-core Athlon II X2 221 operates at 2.8 GHz frequency, and accommodates 1 MB cache memory of the second level. It is …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 13 March 2011, 05:48
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