The Tempered Glass Edition of the Thermaltake Core X71 Chassis

The Thermaltake Company has announced a new Core X71 version of chassis. This solution is called Tempered Glass Edition and is produced in black colour.



One of the novelty’s panels possesses a window out of 4 mm tempered glass instead of the formerly used acrylic panel.


Due to its dual-chamber structure the chassis has much of the inner space, which allows to assemble a PC of almost any complexity with the liquid cooling system utilization.

Motherboards of Mini ITX, Micro ATX and ATX typical sizes can be installed. The maximum number of expansion cards is eight. One can use discrete graphics accelerators of up to 420 mm length.


In the front part of this product, there is enough room to mount a 480 mm heatsink, and it’s possible to install a 360 mm heat dissipator at the top. The preassembled power supply unit length equals to 220 mm.


The dimensions of this full tower chassis by Thermaltake are the following: 677 × 250 × 511 mm.


Unfortunately, the …

NAS QNAP TS-469 Pro Review

Contemporary network storage units have already undergone the evolution era, and nowadays new emerging models do not differ so much from their predecessors. This basically touches upon external integration and major functional. Still, hardware and software layout is constantly changing, offering more advanced, more efficient, and more comprehensive facilities. QNAP has recently launched a series of four-disk stations, with TS-469 Pro model leading the series.



Design and Integration


NAS QNAP TS-469 Pro is based on a steel frame. The casing is made of dark aluminum, while the frontal panel is made of black plastic. The larger part of this panel features a bay for the HDD installation; HDD bay consists of metallic frames and external plastic straps. Right above the bay there is a block of two-array indicators, two control panels and eight LED lights signifying the work of each hard drive, general device status, network connection, USB connection, and eSATA connection.

AMD Announces the Development of Steamroller

Heightened demand for high-end processor solutions and ever rising competition make AMD constantly develop its products. This usually results in the release of really outstanding items, such as already acknowledged Bulldozer and Piledriver. Therefore, according to the words of the companies technical manager, Mark Papermaster, the development of a new processor architecture, codenamed Steamroller, is already on order of AMD's business. The ready-made products are sure to be released next year. Steamroller is called to become the third edition of Bulldozer architecture that launched last year and a loyal companion of Piledriver core.



The initial data witness that processors on Steamroller architecture will be designed in correspondence with 28 nm technological process. This should favorably affect their efficiency and enlarge the performance by 15-20% at equivalent power consumption and clock frequency. At the same time, Steamroller will improve all specifications implemented in …
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Registered at: 23 April 2012, 07:16
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