Biostar Unveils Specifications of A55MLV Motherboard

Biostar has given its new motherboard A55MLV certain prominence, unveiling its main specifications on the official website. Relying on the claimed data, a new product is developed in micro-ATX form factor and is targeted primarily at compact desktops applied in home and office systems. What is more, this motherboard aims at drawing customers who struggle for utmost performance, limitless facilities, and moderate price.



Biostar A55MLV is based on AMD A55 system logics and accommodates Socket FM1 to be compatible with a number of high-end processors. It supports the following APUs from AMD which TDP level does not exceed 100W: E2, A4, A6 and A8 series. This motherboard contains two DIMM slots that support up to 16GB of DDR3 memory type (800, 1066, 1333, 1600, 1866), operating at one-channel or two-channel modes.


The model boasts the availability of four SATA II ports, a single PCI port, one PCI-e 2.0 x16 port, six USB 2.0 ports, network Ethernet LAN 10/100 (Atheros AR8152), …

Meet New High-Speed External Hard Drive Buffalo HD-GDU3

Buffalo Technology, a Japanese manufacturer of all innovatory storage devices and network solutions, showcases a new external hard drive, codenamed HD-GDU3, within the boundaries of DriveStation series. The new drive is housed in a black casing, featuring 45x126x202 mm dimensions. The model is known to have three capacity variations and, correspondingly, three different models: HD-GD1.0U3 (1TB), HD-GD2.0U3 (2TB) and HD-GD3.0U3 (3TB).



These external drives employ 3.5-inch hard drives as the basis and support an advanced high-speed USB 3.0 interface. Their layout involves 1GB of DRAM cache-memory which utilizes a dedicated caching software applet Turbo PC EX2, delivered along with the drives. This applet is called to immensely accelerate the data transfer process. The nominal delivery kit also includes a large software package with encoding and backup programs.


According to Buffalo developers, their HD-GDU3 is the fastest external hard drive ever seen. Thus, the maximal …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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