Thermaltake Readies Armor A30i and A30i Speedy Edition PC Cases

Thermaltake gets ready for the release of two new PC cases, codenamed Armor A30i and Armor A30i Speedy Edition. Both models feature 266x291x456 mm dimensions and boast an original modular framework, known as Bulletproof Armor Design. The cases are housed in a stylish enclosure with a small transparent window on the side panel, ventilation grids on the frontal and top facets. Their prime target is gamers, as well as enthusiasts and LAN Party devotees, who prefer small-sized PC systems.

Thermaltake A30i and its modified version are known to support motherboards of mini-ITX and micro-ATX standard, graphics cards of up to 350 mm in length, and CPU cooler of up to 90 mm in height. Internal layout is ready to offer four expansion slots, a couple of 5.25-inch drive bays (external), one 3.5-inch drive bay (external), a pair of internal 2.5-inch bays and analogous number of internal 3.5-inch bays. The frontal I/O panel consists of two standard audio slots and a couple of USB 3.0 ports. … …

Shuttle Offers a New Stylish NAS Storage Omninas KD22

Shuttle, an eminent Taiwanese developer of mini-PCs and barebone-systems, replenishes its production line with a new NAS, entitled Omninas KD22. The storage features a stylish, solid aluminum case, painted in white, and a large blue button that is responsible for the hot swapping of the drives. Generally, the case can accommodate a pair of 3.5-inch (or 2.5-inch) SATA drives, which support such configurations as JBOD and RAID 0/1.

The heart of Omninas KD22 is Marvell 88F6707 processor that runs at 1.2 GHz. The storage is furnished with 512 MB RAM and might offer up to 8TB of disc space. Being primarily a network-attached storage, the product is able to serve as a media-server as well, supporting iTunes, DLNA, BT, FTP server and print server. Additionally, there is a possibility for several different ways of local data transfer.

In order to fully realize an operational potential, Shuttle equips the model with a card-reader for SD cards with automatic copying options, three …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 14 March 2011, 06:22
Last visit: 05 May 2013, 19:29