ASUS ROG XG Station 2 Turns a Laptop into a Powerful Gaming System

The ASUS Company has officially presented ROG XG Station 2, a unit, which turns a laptop into a powerful gaming system with VR support.



ROG XG Station 2 is an external docking platform for the discrete graphics accelerator. The device is connected to the notebook via a high-speed Thunderbolt 3 interface (with a USB Type-C port). Additionally there is a USB 3.0 Type-B port.


A full-size graphics card can be installed.


ROG XG Station 2 is suitable for the peripherals connection. It can be accomplished due to the presence of four standard USB 3.0 ports, as well as a network cable jack.

The inbuilt power supply unit delivers the capacity of 600 W.


The dimensions of the ASUS device are the following: 456 × 158 × 278 mm.


This novelty will be on sale at the beginning of the year. We should note, though, that this station is compatible only with select laptops by ASUS. The price of ROG XG Station 2 has not been reported yet.

MSI Announces Z170A PC Mate Mainboard

MSI has recently habituated to launching ever newer and more efficient mainboards. This time the company unveils Z170A PC Mate full ATX model that draws power via 24-pin ATX and 8-pin EPS sockets. It is based on Intel Z170 chipset and is estimated for Intel Core LGA1151 (Skylake) CPUs. The core cooperates closely with DDR4 3300 MHz memory (4 slots are available, two-channel mode), the maximal volume of which might achieve 64 GB.



MSI Z170A PC Mate comes equipped with 6-phase VRM system. The model is rich in expansion facilities: it offers one PCI Express 3.0 x16, one PCI Express 3.0 x4, three PCI Express 3.0 x1, and a pair of PCI slots. The connection of drives is realized due to 1x M.2 slot 32 Gb/sec, 1x SATA Express 16 Gb/sec, and 6x SATA III 6 Gb/sec.


As far as interfaces are concerned, this motherboard houses six USB 3.0 ports, four USB 2.0 ports, a couple of USB 3.1 ports, as well as three different video ports: HDMI 2.0, D-Sub and DVI. Besides, network connection …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 08 June 2011, 18:47
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