Spire Tricer 1411 Chassis

The micro ATX PC series has been recently joined up by the Tricer 1411 model. This new PC framework matches the up-to-date specification benchmark and system architecting norms. The Tricer 1411 possesses all special aspects, necessary for a Micro ATX tower case, among which one can find 4 × 120 mm fan mountings and a 120 mm black fan on the rear.



The front design is simple and stylish, though featuring full functionality. Spire Tricer 1411 chassis is designed out of 0.45 mm SPCC steel and is easy to assemble. The Optical, HDD or SSD Drives can be mounted. There are USB 3.0, USB 2.0 and AC97/HD audio ports on the front panel.

Key features:

• Front 1×USB 3.0, 2×USB 2.0 and HD/AC97/AUDIO

• SD/TF card reader

• Solid steel construction

• Compatible with Micro ATX mainboards

• Easy to install

• Refined internal area design

• Enough place for 2×92 mm and 2×120 mm cooling fans

• 1×120 mm black cooling fan on the rear in standard samples

• 2 …

Cooler Master Readies a New Silencio 452 PC Chassis

Cooler Master has added a new PC chassis to its Silencio series. The Silencio 452 is developed in a mid-tower form-factor and features 194x451.4x494.7 mm dimensions. It is peculiar by a sleek design with totally black interior and exterior. The case boasts soundproof side panels and anti-vibration rubber props. The greenhorn is supposed to come on sale in early January, 2014, though the pricing is currently unknown.



Cooler Master Silencio 452 is intended to accommodate motherboards of a standard ATX, as well as a micro-ATX standard. Storage is introduced by two 5.25-inch racks and six internal 3.5/2.5-inch racks. This is quite enough for the assembling of a powerful platform.


Internal layout allows for the installation of quite lengthy graphics adapters (up to 386 mm) and, if necessary, a voluminous liquid-cooling heatsink (240 mm). The latter is supplemented by dedicated rubber grommets on the rear facet.


Initially the chassis is furnished with a pair of low-noise …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
AUTOMATIC SEARCH & INSTALL
device drivers
Freeware
Download (9MB)
DevID agent v4.36
* The Utility requires installation. Upon installation and running DevID Agent will detect
which devices require drivers and which drivers require updates.
The Utility doesn't contain viruses or malicious code
Registered at: 18 December 2011, 20:42
Last visit: 09 January 2012, 14:13