Meet the One-Size-Fits-All Fan from Titan

Titan has introduced a revolutionary, in some way, fan that can be employed for multiple purposes. Except for being a part of cooling system involved in PC enclosure, Cloud Fan can also be utilized as a cooling means in offices, vehicles or at home. The compatibility with the majority of fixtures becomes possible due to the implementation of 1/4-inch perforations. The connection to the power supply is realized by means of three-contact socket.



The casing of Cloud Fan is made of white plastic, and the series counts up two models. One model goes with 140 mm dimensions, while the other – with 120 mm. The major attractive feature of both models is that they are predestined for approximately sixty thousand hours of fail-proof operation. Such peculiarity might attract people willing to get simultaneously an efficient and comprehensive cooling solution.


The 120 mm fan is able to show up to 2200 rpm; the level of noise does not exceed 35 dB. The 140 mm model demonstrates a bit …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 07 May 2012, 11:18
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