SilverStone Heligon HE01 - a new super-cooler

The Taiwanese company introduced a bulky cooler SilverStone Heligon HE01, which is designed to cool down more or less all types of modern CPUs — from Intel LGA775 up to LGA2011 and from AMD AM2 to AMD AM3 + / FM2.

The construction does not weigh less than 1.1 kg, since in addition to two-part radiator (926 g) it is equipped with fan of 140x140x38 mm size. Linear dimensions of Heligon HE01 are 140 mm in width, 119 mm in length and 160 mm in height. Staples that hold the fan, take a few millimetres of space.

The thickness of a pair of «towers», joined by six nickel-plated copper heat pipes with a diameter of 6 mm, is uneven. The intense air flow passes successively through a thin array of aluminium fins, and then through the fan, afterwards through a larger section of the radiator. Copper base with nickel cover is protected with a film from scratches.

The manufacturer claims that Heligon HE01 will cope with the withdrawal of 300 watts of heating power.

Regular …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 05 December 2011, 00:00
Last visit: 05 December 2011, 00:22