AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.

The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.

According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …

Dell Launches a Prime-Class UltraSharp U2414H PC Monitor

Dell has just started the sales of its newest U2414H monitor, which is a part of high-class UltraSharp series. The greenhorn features 23.8-inch display and the world’s thinnest border of 6.05 mm in depth, providing for a striking imaging. The heart of the model is IPS panel that ensures Full HD resolution (1920x1080 pixels). The combination of all remarkable specifications is backed by a 3-year’s limited warranty. Customers are able to acquire this monitor for the price of about $350.

Dell UltraSharp U2414H offers ideal adjustability options. Hence, users can alter height, aspect, tilt and swivel of the aluminum stand, as well as pivoting the display clockwise or counter-clockwise. Thanks to wide viewing angles (178/178 degrees in vertical and horizontal aspects), all images remain accurate and sharp, irrespective of the stand adjustments. If there is a need, the display can be utilized without the stand by means of a compatible VESA bracket.

In addition, the model …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 26 July 2012, 06:41
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