The Release of Two 3D Graphics Cards from Sparkle Computer

Sparkle Computer, a Taiwanese supplier of graphics solutions and consumer electronics, has released two 3D graphics cards simultaneously. The two models have been codenamed Calibre X680 Captain and Calibre X670 Captain. Both cards are based on Nvidia GK104 GPUs developed under 28 nm standards. The chief peculiarity of the products is the integration of extraordinary cooler CoolPro; the uncommonness is seen in the localization of three fans that found their places under the radiator. This radiator is connected with the base, which is in direct touch with GPU, by means of six heat pipes.



Calibre X680 Captain and Calibre X670 Captain are equipped with DisplayPort, DVI, DVI-D, and HDMI video outputs. Graphics cards employ PCI Express 3.0 interface and support DirextX 11 interface, as well as, such Nvidia technologies as CUDA, PhysX, 3D Vision, and 3D Vision Surround. They are also notable for the availability of eight-phase voltage regulators and the enhanced depth of ground on the …

Gigabyte to Start Selling X99M-Gaming 5 Motherboard

Gigabyte Technology is about to come out with a new micro-ATX gaming motherboard. The X99M-Gaming 5 features a promising black-and-red design, an enforced VRM system, and a sophisticated cooling solution. It is powered by Intel X99 chipset compatible with Intel Core i7/Haswell-E processors for socket LGA 2011-3. Heat dissipation process is entrusted to aluminum heatspreaders, joined by a nickel-plated copper heat-pipe.



The motherboard comes equipped with Ultra Durable hardware base, including solid-state capacitors with a prolonged lifespan. Moreover, it boasts advanced tools against short circuit on USB and Ethernet ports as well as against heightened humidity. Memory subsystem is introduced by four DIMM slots for DDR4-2133 modules (up to 32 GB capacity). Expansion facilities are backed by three PCI Express 3.0 x16 slots (the possibility to create 2-way CrossFire and 2-way SLI configurations), and a single PCI Express x1 slot.


To continue, in order to organize a data …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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