Corsair Introduces a Spacious 'Godzilla' PC Case

Corsair, known for its multifarious PC hardware products line, has introduced its new chassis with a promising name Obsidian 900D Godzilla. The attribute 'Godzilla' speaks for itself: the case features truly voluminous dimensions of 655x694x251 mm. Its weight is also impressive and its internal layout is ready to welcome the whole galaxy of motherboards of different form-factor, including ATX, XL-ATX, E-ATX, HP-ATX.



Obsidian 900D Godzilla goes in black coloring and one of its side panels is equipped with a transparent acrylic window that uncovers some internal components. Such impressive dimensions offer free spacing for the integration of fifteen (!) 3.5-inch (or 2.5-inch) drives, ten PCI expansions cards, and four bays for the drives of 5.25-inch dimensional type. The input/output interface panel is represented by 3.5 mm audio connectors, a pair of USB 2.0 ports and four USB 3.0 ports.


It should be stated that this PC case is delivered with a pre-installed water-cooling …

RunCore Highlights a New Business SSD Kylin III

Each and every SSD, supplied by numerous reputable companies, offers practically unbelievable Write/Read speeds, as well as prolonged durability. Indeed, the developments in this segment have achieved considerable heights, presenting unprecedented facilities for potential customers. RunCore does not leg behind the others and highlights with special honor its new business solid-state drive model, codenamed Kylin III. This model is primarily destined to be employed in highly-demanding systems, such as databases, server PCs, HPC systems, and many other high-end applications.



SSD Kylin III will be delivered in three capacity variations: 450GB, 785GB and 1.6TB. All models are based on MLC NAND memory type and employ PCI Express 1.0 x8/2.0 x4 interface. They are initially characterized by an amazing utmost performance: up to three million IOPS in random Read mode (512 byte). Moreover, the user is capable to create RAID array, combining a few SSDs Kylin III; this will dramatically …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 16 July 2011, 22:56
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