Greeting a Pair of Liquid Freezer 120 & 240 Coolers

Arctic announces a pair of liquid cooling systems entitled Liquid Freezer 120 and Liquid Freezer 240. They are targeting the most demanding CPUs designed by Intel & AMD. The first model perfectly matches processors with up to 250 W TDP, while the second one might cope with 300 W TDP. Pricing is set at 100 EUR and 130 EUR correspondingly. Both new-comers are shipped with a brand Arctic MX-4 thermal compound.

Arctic Liquid Freezer 120 accommodates a waterblock with a copper base, an efficient pump, 120-mm heatsink, long connecting hoses (326 mm), and a couple of 120-mm fans, based on a fluid dynamic bearing. They are monitored by means of PWM technology, enabling them to rates within 500-1350 RPM speed range. At the same time, the maximal noise level does not exceed 0.3 Sone.

To continue, Arctic Liquid Freezer 240 is distinguished by the implementation of a 240-mm heatsink and four 120-mm fans. Tests prove, that this cooler is able to maintain the temperature of Intel Core …

Lian Li to Release a New PC-Q35 Case with a Door Lock

Lian Li, a Taiwanese vendor of unique PC cases, is about to release a new mini-ITX case in the Western European market. Entitled PC-Q35, the model features 514x261x356 mm dimensions and weighs 4.3 kg. It is peculiar by a classical brand Lian Li’s design with minimum decorations and great functional. Nonetheless, its main peculiarity is the implementation of a lock on the frontal door. The new-comer is already available for pre-order for a price of 129 EUR.

Lian Li PC-Q35 will come in two color solutions, black and silver. The chassis takes benefit of anti-dust filters and metallic feet with rubber soles; the latter are called to efficiently damp the vibrations. Internal layout supports for the installation of mini-ITX and mini-DTX motherboards, a pair of PCI Express expansion cards of up to 300 mm in length, ATX-compatible power supply unit up to 200 mm in length, and CPU air cooling system of up to 95 mm in height.

To continue, available storage facilities provide for …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 02 October 2012, 15:59
Last visit: 02 October 2012, 15:59