Biostar H61MU3B Offers a Universal Set of Up-to-Date Interfaces

Biostar company announces the release of a new motherboard H61MU3B – a high-end tool for the creation of compact multimedia platforms with the universal set of up-to-date interfaces. According to the words of the company’s representatives, H61MU3B is able to support the majority of Biostar functional capabilities, including Remote 2, Bio-Flasher and Bio-ReLife, Driver-Genii technologies, as well as BioScreen Utility applet. Remote 2 technology is used to manage the multimedia system with the help of Apple and Android gadgets; Bio-Flasher and Bio-ReLife technologies are used to update and reclaim Bios functional from the external USB drives; Driver Genii is used to install all necessary drivers automatically. BioScreen Utility applet enables the choice of download logo and is equipped with eHot-Line service which secures the efficient technical support.



Motherboard Biostar H61MU3B has got an enhanced framework and design. Thus, motherboard framework is furnished with the …

ASRock Outs N3150DC-ITX Mainboard

ASRock has gladdened all devotees of small-sized, power-efficient & sustainable PC/multimedia systems by the introduction of a mini-ITX motherboard, entitled N3150DC-ITX. The model comes equipped with a 4-core Intel Atom N3150 CPU, running at 1.6 GHz basic frequency with the possibility to overclock up to 2.08 GHz frequency. Its key privilege is a sparing TDP level – 6 W only.



ASRock N3150DC-ITX boasts a totally passive cooling: the PCB houses a noiseless heatspreader without a fan. Memory subsystem is represented by two SO-DIMM slots which support the installation of DDR3/DDR3L-1600 MHz modules. The PCB teases only top-tier hardware components, including solid-state capacitors, ELNA audio caps, etc.


Storage might be organized due to a pair of SATA III 6 Gb/sec ports and the same number of SATA II 3 Gb/sec ports. A single PCI-e 2.0 x1 slot is intended for an expansion card, while mini PCI-e Express slot – for a wireless network interface module.


Audio subsystem …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 22 September 2012, 16:25
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