New Budgetary Chassis K380 from Cooler Master

Cooler Master announces the release of a new entry-level chassis K380 (RC-K380-KWN1). This model will replenish the K Series of products and will feature mid-tower parameters (209x445x479 mm overall dimensions). K380 is basically intended at gamers, due to an eye-catching design: the chassis is housed in a solid casing made of steel and plastic with some aggressive inclusions and details. However, the major distinctive peculiarity ascribed to the newbie is its moderate price that will not exceed the border of $80. Affordability affirms Cooler Master's image of the company that skillfully combines high-quality with alluring prices.

The chassis is painted black from the inside and outside and accommodates a metallic grid on the frontal panel. Its side panel is notable by the availability of a large transparent window that showcases internal layout. In its turn, internal spacing is sufficient to locate motherboards of ATX and micro-ATX form-factor, graphics cards of 316 mm in …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Zalman Debuts with Reserator 3 Max Dual Liquid Cooler

Zalman has officially launched a new liquid cooling system, Reserator 3 Max Dual, firstly introduced at CES 2014. It is peculiar by the support of all up-to-date CPU sockets for AMD and Intel platforms, as well as by outstanding performance. With the aim to enhance heat dissipation effect, the company supplements the model with a proprietary Zalman ZM-STG2M thermal grease.

Zalman Reserator 3 Max Dual consists of a waterblock with a copper base, two connecting hoses, two heatsinks, and a pair of 120 mm fans. The base of the waterblock boasts an improved framework; it has got a flanged coating that promotes for the acceleration of heat dissipation. Both heatsink sections are nickel-plated. The heatpipes implemented within their framework resemble a maze; this allows liquid to employ the maximal dispersion area.

The incorporated 120 mm fans are equipped with a long life bearing and a bright blue LED. Their operation is adjusted by means of PWM technology, so the rotational …
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Registered at: 20 April 2011, 18:11
Last visit: 20 April 2011, 18:11