The Attractive ID-COOLING ICEKIMO 120W Liquid Cooling System

This time the well-known ID-COOLING company decided to attract customers not with high performance specifications, but with its new liquid cooling system’s original and extraordinary layout.



A heat dissipator, a pump, tubes and a fan with white backlighting are completely WHITE, which evoke associations with ice-cream, ice or snow.


The dimensions of the 14 channel aluminum heatsink are 154 × 120 × 27 mm. FPI number is 20.

An ID-12025M12S fan is of 120 × 120 × 25 standard size. Its max rotary speed is 700–1500 rpm, max air flow ratio is 62.0 cfm, max static pressure is 1.78 mm H2O and the noise level is 18.0–26.4 dBA. The power consumption is announced to be 3.0 W.


The dimensions of the copper microchannel water unit are the following: 68 × 68 × 35.6 mm. It is compatible with Intel LGA115(х)/1366/2011/2011-v3 and AMD Socket AM2(+)/AM3(+)/FM1/ FM12(+) platforms. The cooling agent is nontoxic and anticorrosive.


The total weight of the system makes 639 …

Power Supply Unit OCZ ZX-1250 Review

The employment of high-end power supply units will not lose its topicality for a long time. This fact can be explained by the development of ever powerful components which require reliable and solid PSU to support their operation. OCZ company perfectly understands the current tendencies and tries to meet the heightened requirements by designing high-end, reliable and steadfast PSUs. Its ZX-1250 is considered to be the most powerful model in the available line of products, so it will be a perfect supporter for gamers and just enthusiasts willing to 'extract' more from their PCs.



Framework


The basic peculiarity of OCZ ZX-1250 is its entirely modular framework. This serves the identifying feature, separating this model from other products. Modular construction presupposes the possibility to toggle off absolutely all cables along with the main, 24-wire ATX power cable. Such framework will be met with approval by those customers who got used to move their PC from one place to …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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Registered at: 16 March 2011, 15:58
Last visit: 15 August 2011, 18:45