Greeting Deepcool Wave Mini-Tower Case

Deepcool Industries Co. Ltd., a renowned Chinese developer of PC cooling solutions, is about to launch another top-notch chassis, codenamed Wave. This mini-tower model, featuring 387x175x353.5 mm dimensions, is supposed to accommodate micro-ATX systems. Despite a sleek design and enhanced functionality, entry-level customers will be able to acquire the new-comer for some $30-40.

Deepcool Wave is housed in a steel chassis (0.5 mm SECC) with plastic details. Its internal layout is predestined for two 5.25-inch drives, a triple of 3.5-inch drives and the same number of 2.5-inch drives. Expansion facilities are ensured by means of four PCI slots. There is enough space for the installation of 145-mm-high CPU cooler, 320-mm-long graphics cards, and ATX-compatible power supply unit.

The chassis comes with a single preinstalled 120 mm frontal fan, equipped with blue LED backlight. There is a possibility to boost air cooling by integrating two more fans. Connectivity is secured …

Qualcomm Unveils Snapdragon 425, 435 & 625 Mobile CPUs

Qualcomm has added three new mobile processors to its Snapdragon lineup. The Snapdragon 425, 436 and 625 boast improved functional, higher level of performance as well as longer-time of off-line operation for tablets & smartphones. The triplet entails 4/8 ARM Cortex-A53 CPU cores which run at 1.4 GHz (425, 435)/ 2.0 GHz (625 model) frequency.

The least efficient CPU is Qualcomm Snapdragon 425. It’s equipped with Qualcomm Adreno 308 graphics core and shows compatibility with eMMC 5.2 drive, LPDDR-667 MHz RAM, 16-megapixel cameras of 1280x720 resolution. Qualcomm Snapdragon 435 accommodates a more efficient Adreno 505 graphics core. It is able to cooperate with LPDDR3-800 MHz memory, internal eMMC 5.1 drives as well as external SD 3.0 memory cards.

In its turn, Qualcomm Snapdragon 625 is thought to be the most powerful CPU in the series. It is based according to 14-nm technological process and Adreno 506 GPU. This model can work with LPDDR3-933 MHz RAM and 24-megapixel …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 17 November 2012, 22:51
Last visit: 27 December 2012, 06:47