Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Greeting Versa H23 and H23 Window Cases from Thermaltake

Budget-oriented series of PC cases from Thermaltake has been replenished with two new models: Versa H23 and Versa H23 Window. The mere difference between the two enclosures is the availability of a side-faceted acrylic window in ‘Window’ version. Still, both mid-towers feature 429x209x491 mm dimensions and come with a totally black coating. Their internal spacing is sufficient to include standard ATX, as well as contracted micro-ATX motherboards.



Thermaltake Versa H23 and H23 Window boast two 5.25-inch, six 2.5-inch and three 3.5-inch trays for the installation of various drives. All of them might be mounted without any special tools, due to a polished clipping system. The cases offer seven PCI slots to expand the system’s functional.


Additionally, the models support the installation of CPU coolers of up to 156 mm in height, graphics cards of up to 315 mm in length, and a standard PS/2 power supply unit. The I/O panel is located in the top-front panel. It embraces …
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Registered at: 13 June 2011, 01:48
Last visit: 13 June 2011, 01:48