Meet the Most High-Powered Server GPUs from AMD

AMD has just released two new graphic processing units intended for solid server systems: AMD FirePro S7000 and S9000 models. According to the claimed specifications, both models are the most high-powered server GPUs currently available in the market. Their major destination is the application in different fields, including multimedia content editing and CAD. S7000 and S9000 can be used as graphics solutions in the complement of large data-centers and within the infrastructure of virtual desktops.



Both units are developed on an advanced Graphics Core Next architecture and support progressive brand technologies, like ZeroCore Power and PowerTune. Those technologies are called to reduce power consumption by almost 95% in idle mode. In addition, those GPUs support virtualization technologies designed by Microsoft, VMware, and some other developers. Both products are equipped with passive cooling system. High level of operating speed makes the models applicable in the most …

Zalman Intros CNPS8X Optima CPU Cooler

Zalman is considered to be a key player in PC hardware field mainly due to a perfect combination of quality, functionality and price tags. CPU coolers are not an exception, since they ensure efficient and low-noise cooling of hard-hitting processors. The company’s latest CNPS8X Optima cooler is all about innovation that turns it around. Improved framework makes the model compatible with practically all platforms from Intel and AMD, save for Intel Socket LGA 2011/2011-v3/1366.



Zalman CNPS8x Optima employs a large heatsink, three copper heatpipes, and a single 92 mm fan. The latter is based on long-life bearing and features 4-contact connector. It is able to rotate at about 1200 RPM, producing not more than 30 dB noise.


The list of innovative technologies integrated into the cooler includes:


— Direct Touch Heatpipe (DTH) technology wherein all three heatpipes are in direct touch with a heatspreader. This accelerates heat dissipation process, enhancing overall …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 20 December 2011, 02:01
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