AMD Announces the Development of Steamroller

Heightened demand for high-end processor solutions and ever rising competition make AMD constantly develop its products. This usually results in the release of really outstanding items, such as already acknowledged Bulldozer and Piledriver. Therefore, according to the words of the companies technical manager, Mark Papermaster, the development of a new processor architecture, codenamed Steamroller, is already on order of AMD's business. The ready-made products are sure to be released next year. Steamroller is called to become the third edition of Bulldozer architecture that launched last year and a loyal companion of Piledriver core.



The initial data witness that processors on Steamroller architecture will be designed in correspondence with 28 nm technological process. This should favorably affect their efficiency and enlarge the performance by 15-20% at equivalent power consumption and clock frequency. At the same time, Steamroller will improve all specifications implemented in …

Ultrabook Lenovo ThinkPad X1 Carbon will debut on August 21

In May this year, Lenovo, HP, along with being the largest manufacturer of branded PCs, has announced plans to release 14-inch ultrabook premium-level ThinkPad X1 Carbon. In order to attract affluent buyers who are in search of a fashion mini-PC, the frame and lid are made of CFRP (carbon fiber) — lightweight and durable material that is used, including in the aerospace industry, and expensive cars. Due to this, the thickness of the laptop is reduced to 17.7 mm, and weights — up to 1.36 kg.



Screen of Lenovo ThinkPad X1 Carbon has a resolution of 1600x900 pixels, a maximum brightness of 300 and wide viewing angles. Graphic system is presented by built Adapter Intel HD 4000 into the processor Ivy Bridge. RAM is 4 GB and can be expanded up to 8 GB. Keyboard ThinkPad Precision doesn’t have numeric keypad, but it has an LED backlight.


In addition, the novelty has a webcam 720p, battery with a resource of battery life of up to 6 h 20 min., fingerprint scanner, connectors …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …
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