Corsair to Release Hydro Series H5 SF Liquid Cooler

Taking into account the increasing number of cases when it’s impossible to install highly efficient air coolers on mini-ITX motherboards, Corsair has developed a universal low-profile liquid cooler. Entitled Hydro Series H5 SF, the unit shows compatibility with the majority of small-sized platforms for Intel LGA1366/115x and AMD FM1/FM2/AM2/AM3 sockets. Besides, this model is able to manage with up to 150 W of thermal power.

Corsair Hydro Series H5 SF is distinguished by an unusual framework. It employs dedicated props which hover the heatsink over the motherboard; thus, the system does not require additional space within the case. The base is made of polished copper.

The aluminum heatsink (167x40x57) is accompanied by a 120-mm fan that drags out hot air from heat-generating components. Its rotation speed varies from 1000 RPM to 1800 RPM, producing 12-24 CFM airflow. Still, the fan appears to be rather noisy with the peak levels of 36-42 dB.

Corsair bundles the …

SilentiumPC Launches All-Powerful Grandis XE1236 CPU Cooler

SilentiumPC has announced the release of its newest cooling solution – an all-powerful Grandis XE1236 CPU cooler. The model features 130x105x158 mm dimensions and weighs 1160 g. According to the manufacturer, it is able to manage heat on top loading, preserving CPU in sober thermal conditions. The cooler is backed by a 2-year’s warranty and comes at $49.

SilentiumPC Grandis XE1236 consists of a copper base, six U-shape heatpipes (6 mm), a two-section aluminum heatspreader with a polished base, and a pair of fans of 120 mm dimensions. The GF12-25 fans are based on a fluid-dynamic bearing that is set to demonstrate up to 50 thousand hours of fool-proof operation.

To continue, the connection to the motherboard is realized via 4-pin connector. The fans might operate at +12V voltage, accelerating speed from 500 RPM to 1500 RPM due to PWM technology support. On the maximal speed the noise level does not exceed 21 dB. Upon the whole, the blades can produce up to 55 CFM …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 30 September 2012, 17:17
Last visit: 30 September 2012, 20:06