New Gaming PC Chassis Versa G2 from Thermaltake

Thermaltake, a renowned Taiwanese PC hardware developer, has officially divulged the specifications of its new gaming chassis, codenamed Versa G2. The belonging to the gaming echelon is vindicated primarily by an eye-catching design. The casing is developed in mid-tower form factor, and is made of a durable steel (SGCC) and plastic. Its side plate contains an acrylic window with a few ventilation grids that showcase the internal layout of the chassis.



Thermaltake Versa G2 features 481x196x429 mm dimensions and is alloted for seven PCI/PCI Express expansion cards. It supports motherboard of ATX and micro-ATX standard and is notable by lower PSU localization. The internal spacing within the enclosure is sufficient for the installation of CPU cooler not more than 155 mm in height and of graphics card not more than 320 mm in length. The model is equipped with three external 5.25-inch drives and a single 3.5-inch drive, as well as with five internal 3.5-inch and a single 2.5-inch …

A 2-Fan Cooler GeForce GTX 1050 WINDFORCE 2G Graphics Card From GIGABYTE

The GIGABYTE company has officially introduced a new graphics card, named GIGABYTE GeForce GTX 1050 WINDFORCE 2G (GV-N1050WF2-2GD). It possesses such peculiarities as refined PC-board design and a modified cooling system.



GIGABYTE GeForce GTX 1050 WINDFORCE 2G is based on a 14 nm NVIDIA GP107-300 GPU, supporting 640 CUDA, 40 TMU and 32 ROP. This video card can operate in one of pre-set modes – “Gaming” or “OC”. Its frequency formula goes in accord with the benchmark of 1354 / 1455 MHz in the first case and 1379 / 1493 MHz in the second. At the same time 2 GB of GDDR5 memory work at the reference effective frequency of 7008 MHz.


The PC-board is improved due to the Ultra Durable VGA company concept and an enhanced 4+1-phase power subsystem construction with one 6-pin PCIe connector. The power supply subsystem design features one copper composite heat pipe, an aluminum heat sink, a stiffening plate on the reverse side and a pair of axial fans. At low load the cooler …

Micron to Carry Out the Production of TLC Memory Next Year

Memory market, similar to other industries, undergoes certain changes and updates from time to time. Therefore, memory manufacturers are currently trying to comply their production with two major tendencies: considerable drop in demand for RAM, employed basically in desktop PCs, and simultaneous growth of demand for solid-state drives, employed in compact tablets and mobile devices. Besides, the latter is developed at lightning speed.



Micron, one of the leading memory manufacturers, feels like no one else all the changes and fluctuations in the market. Its quarterly reports witness about the relentless drop in demand for DRAM (9% drop at average) for the report period. At the same time, increase in SSD segment is estimated at 5% at average. Sales volume of NOR memory type did not outlive serious changes.


According to the preliminary data, Micron is going to carry out the production of memory on TLC microchips, manufactured under 20 nm technological process. The assumed …
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Registered at: 21 November 2012, 11:57
Last visit: 21 November 2012, 12:16