HIS Showcases New Graphics Card with Improved UVD GPU

The line of graphics cards manufactured by HIS has been recently replenished by an alternative Radeon HD 7950 IceQ Boost Clock model. The card takes a modified graphics adapter from AMD and is based on Tahiti PRO chip, developed according to 28 nm technological process. This chip houses 1792 current processors which are designed under an advanced Graphics Core Next architecture.

One of the major technological peculiarities pertained to a new model is the implementation of a unique two-slot IceQ cooler that involves an aluminum heatsink, four copper heat pipes and low-noise powerful fan. As claimed by the manufacturer, the integrated cooling system exceeds the cooler applied in the reference model in terms of heat dissipation power and noise. Hence, noise level produced by IceQ does not exceed the boundary of 28 dB; at the same time, it reduces the GPU temperature at 12 degrees as compared with the reference model.

To continue, Radeon HD 7950 IceQ Boost Clock is based on a …

Preview of video-card Club 3D Radeon HD 7970 royalAce

Club 3D has released fifth model of the Radeon HD 7970 — with the prefix royalAce in the codename. Before «ace» there were represented “the king” HD 7970 royalKing and “Queen” HD 7970 royalQueen. New model works at higher frequencies, and supports dynamic overclocking. Into the configuration of Club 3D Radeon HD 7970 royalAce inserted 2048 stream processors. Nominal of core is 1050 MHz in normal mode and 1100 MHz in 3D-games. GDDR5 memory chips make total of 3 GB and operating at 6 GHz, the memory bus is 384 bits.

Club 3D Radeon HD 7970 is notable by its effective use of a proprietary cooling system. It is equipped with a dual-slot cooling system royalAce consisting of at least three copper heat pipes, an array of aluminum fins and a pair of fan size 80 mm. According to the manufacturer reports, the construction is very quiet (31.5 dB in the normal mode of operation, 38 dB — under load), and secondly, provides a nice temperature (average during the game GPU …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Date of birth: 17 January 1991
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Registered at: 29 October 2011, 17:26
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