Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Meet the 2nd Generation of Maximus 2 Platform from Nvidia

Last November Nvidia 'shattered' the IT market with its Maximus platform. Currently, the company is officially presenting the second generation of the platform – Maximus 2. The new platform is based on the advanced GPUs which employ Kepler architecture. The major task assigned to the Maximus 2 is to provide an unmatched performance and efficiency in quite different spheres of enterprise, starting from computer graphics and finishing with oil industry. Besides, it has got improved facilities of virtualization and analyzing activities.



According to the data claimed by the manufacturer, workstations developed on Maximus 2 platform will be put into sale already this December. It is already known that there are a number of companies that will employ Nvidia Maximus 2 in their product lines. Hence, such companies as Dell, HP, Lenovo, Supermicro, and BOXX technologies will introduce their workstations based on this platform.


It should be stated that the second generation of …

Minimalism in new Lian-Li PC-Q25 hull

The market of computer components is growing rapidly. The developers of processors integrate in them elements of system logic, graphics core and other components that were recently placed on the motherboard in the form of individual chips. Motherboard manufacturers have begun to integrate their products with network and sound chips even earlier. All this allows making motherboards, and as a result, systems based on them more compact. The company Lian-Li have understood this tendency and provided the market with the entire line of compact hull designed for motherboard size Mini-ITX.



Consider the model Lian-Li PC-Q25:

— Hull Type — Mini-Tower;

— Dimensions in mm — 280 (H) x 199 (W) x 366 (D);

— Material – Aluminium;

— Weight, kg — 3.1;

— Color: Black / White;

— Form Factor — Mini-ITX/Mini-DTX;

— Devices 3.5 "/ 2.5" internal — 7/3;

— Supported number of expansion cards – 2;

— Fans 1x 140mm, 1x 120mm;


Delivery …
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Registered at: 04 March 2011, 09:33
Last visit: 04 March 2011, 09:33