The growth of laptop shipments in the second quarter was 5%

Global laptop shipments have faced with glut stocks in March and a weakening global economy in May. That caused the situation of reaching a growth of supply in the second quarter of the year only for 5% compared with the previous, and it fell by 1.8% compared with this period year ago. Shipments totalled just over 50 million units, according to analysts.



Numbers of Acer and Lenovo laptop shipments were at the average level on the world market in comparison the first quarter of the year. Shipments of mobile PCs from HP, Dell and Toshiba have fallen to 4-7%. Most of all with the increase of supply by 36% managed its shipment the ASUS Company.


It is interesting that HP may soon lose its title of leader in the laptop market — China's Lenovo breathes down its neck, lagging behind only with 500,000 units. ASUS surpassed Dell, becoming the fourth largest producer of mobile PCs in the world with a share of 11.3%, and Apple and Samsung are in the seventh and eighth places …

PowerColor Intros New Graphics Card with Fling Force Cooler

TUL Corporation, in the framework of its PowerColor brand, introduces a new graphics card with quite an original way of air cooling organization. The new-coming adapter, codenamed PowerColor Radeon HD 7850 Fling Force, employs 'two-storied' cooler of an unusual structure. Along with an aluminum heatsink, copper heat pipes, and a voluminous fan, the manufacturer implemented non-monolithic fan ribs. Their tips are fixed to the main part in a way to change their location relative to the plain of rotation.



On conditions of low rotational speed, tips of the ribs are located at approximately 80 degrees angle relative to the graphics card. On conditions of heightened speed, the ribs become more linear; this way, the impeller diameter enlarges from 92 mm to 95 mm. Such structural approach to the fan framework develops into an improved performance and air cooling effect.


The model is based on Pitcairn chip, developed on Graphics Core Next architecture under 28 nm technological …

G.Skill Showcases New RAM Memory Modules TridentX DDR3

Long-awaited Computex 2013 has brought to light the whole galaxy of innovative hardware ideas. RAM market has also replenished with new entries, partially due to G.Skill International. Its new RAM modules, codenamed TridentX DDR3, are an embodiment of utmost performance, reliability and compatibility. The new-comers have been developed to support the latest Intel’s Haswell-based CPUs i3/i5/i7, integrated into Intel Z87 Express chipset.



TridentX DDR3 are introduced by sets of two and four 240-contact DIMM modules, the total capacity of which achieves 8 GB, 16 GB and 32 GB. All of them are equipped with original in design heatspreaders. They are also known to support Intel XMP overclocking profiles and to operate at 1.65 V power voltage.


Detailed Specifications


TridentX DDR3-3000 modules will be available in 4x8 GB kits (32 GB). Their effective frequency showings make up 3000 MHz with 12-14-14-35 latencies.


TridentX DDR3-2933 modules will be available in 2x4 …
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